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Liquid cooling systems

Liquid cooling loops

An Eaton Boyd Thermal liquid cooling loop is a specialized assembly with one or more cold plates connected with a single inlet port entering the enclosure and a single outlet port. Liquid cooling loop fittings and tubes are designed to quickly and reliably connect to coolant distribution unit (CDU) manifolds in a complete liquid cooling system.

As next generation processors develop, especially in data center, cloud and artificial intelligence applications, each heat source or processor requires its own cold plate to meet high performance specifications. Common liquid cooling loop configurations serve two, four, six, eight or more processors.

Eaton Boyd Thermal liquid cooling loops, direct liquid cooling cold plates, CDUs and manifolds are all designed to optimize performance in harmony as a liquid cooling system with ultimate reliability. Existing Eaton Boyd Thermal liquid cooling system designs are available for all major processors, making them efficient plug-and-play liquid cooling systems for any data center or AI installation.

Eaton liquid cooling

Why use a liquid cooling loop?

Liquid cooling loops offer several advantages over using individual liquid cold plates and heat sinks. A single inlet and outlet port simplifies installation by enabling a top-down assembly process. Board maintenance is easily and readily accessible because our liquid loops are hot swappable, efficient.

By using a one-to-one ratio for liquid cold plate to devices, system designers can focus on optimizing the mechanical attachment and reducing thermal interface resistance from the thermal interface material, maximizing thermal performance.

Why use liquid cooling loops from Eaton?

From design concept to complete product validation, our exceptional quality and expertise can elevate your next liquid cooling loop project. We excel in rapid designs, high quality manufacturing on three continents, 100% testing and manufacturing at scale to support demanding specifications, requirements and launch schedules.

Eaton leak free

100% leak-tested and exceptional quality
 

Performance

We 100% test thermal and flow performance of our liquid cooling loops. We’ve had over 15 years of experience designing and fabricating liquid loops for exceptionally demanding high performance computing systems and cloud compute architectures.

Brazed joints

Our copper brazing expertise and fixture design capabilities provide high-volume scalability without affecting braze joint quality. Our cold plate brazing process creates the mechanical equivalent of a one-piece design for ultimate durability, quality and reliability.

Quick disconnects (QDs)

Eaton builds loops using quick disconnects with a deep working history and knowledge of custom quick disconnects and universal quick disconnects (UQDs). Our flushing and drying process ensures customers have clean loops with no particles over 100 microns which can cause QD leaks. Eaton Boyd Thermal liquid cooling loops are delivered free of any residual coolant, which is ideal for filling with coolant during commissioning.

Nitrogen testing hermetic seals

When liquid cooling ports are terminated with quick disconnects, which are required in cloud compute applications, we use a hermetic seal to pressurize the loop with nitrogen. This extra quality check leverages shipping time and receiving pressure check to ensure no leaks. All QDs are individually leak tested before assembling to a loop.

Reliability testing

Leverage our in-house test lab to ensure long-term reliability and performance of your liquid loop. Our in-house capabilities include temperature cycling, power cycling, thermal shock, shipping tests and more. We have also supported certification to UL / IEC 62368-1 which requires 2 weeks soak with coolant at 85° C and then hydrostatic pressure test at three times the specified operating pressure.

Design options

Most of the design load of a cooling loop is the cold plate. By eliminating this design stage, we can significantly shorten loop development when we use Eaton Boyd Thermal reference design cold plates. We have LCP reference designs for some of the latest AMD, Broadcom, Intel, and NVIDIA chips. We have developed durable cold plates for CPU, GPU and switch chips in addition to memory, optical transceivers, power modules, solid state drives and other support chips. We leverage our extensive liquid cooling expertise to build reference designs with straight, impinged or high-flow impinged style liquid cold plates. We will mix and match our existing designs to build an appropriate liquid cooling loop. While we typically see loops between 2 and 4 cold plates, we’ve produced loops that include up to 16 cold plates.

Eaton liquid loop
Eaton liquid loop

Optimize for your specific installation

Our engineering and design team utilizes flow network simulations to determine the right operating point based on the coolant distribution unit and manifold selection. From there, the team can design appropriate liquid cold plates, tubing and fittings to meet your performance needs. From there, the team can design-in appropriate liquid cold plates, tubing and fittings to meet your performance needs.